Microelectronics International

Microelectronics International

ISSN: 1356-5362
 
DESCRIPTION
Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The journal comprises a multi-disciplinary study of the various technologies, processes and current practices associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages.
 
AUDIENCE
University and departmental libraries, research and scholarly institutes.
 
SUBJECT AREA AND CATEGORY 
Engineering, Electrical and Electronic Engineering; Materials Science, Electronic, Optical and Magnetic Materials, Surfaces, Coatings and Films; Physics and Astronomy, Atomic and Molecular Physics, and Optics, Condensed Matter Physics
 
IMPACT FACTOR: 0.840

 

QUARTILE: Q2
 
ABSTRACTING AND INDEXING
• Academic Source Complete 
• BRISDAT (British Science Database)
• CSA Engineering Research Database
• CSA High Technology Research Database with Aerospace
• CSA Materials Research Database with METADEX
• CSA Technology Research Database   
• EBSCO
• EI Compendex
• INSPEC
• Journal Citation Reports/Science Edition
• Norwegian Register for Scientific Journals
• ProQuest Science Journals
• QUALIS
• ReadCube Discover
• Recent Advances in Manufacturing Database (RAM)
• Referativnyi Zhurnal 
• Scopus 
• TOC Premier
• Zetoc 
• Web of Science
 
EDITORIAL BOARD
Editor
Dr John Karl Atkinson
Faculty of Engineering and the Environment, University of Southampton, Southampton, SO17 1BJ, UK
Editorial Assistant
Dr. Sherry Xu, University of Southampton, UK
Publisher
Emma Steele
Content Editor
James Martin
Editorial Advisory Board
Professor Khalil Arshak, University of Limerick, Ireland
Professor Andrzej Dziedzic, Wroclaw University of Technology, Poland
Dr. Chong Leong Gan, Broadcom Corp, Malaysia
Dr Eduardo Garcia Breijo, Universidad Politecnica de Valencia, Spain
Dr Tech-Joo Goh, Intel Technology Development Co Ltd, People's Republic of China
Professor Leszek Golonka, Wroclaw University of Technology, Poland
Mr Andrew Holland, IMAPS, UK
Dr Thomas Maeder, Ecole Polytechnique Fédérale de Lausanne, Switzerland
Professor Hamid M. Sedighi, Shahid Chamran University of Ahvaz, Iran
Professor K N Seetharamu, M S Ramaiah School of Advanced Studies, India
Dr Marios Sophocleous, University of Cyprus, Cyprus
Professor Ivan Szendiuch, Brno University of Technology, Czech Republic